Au / Pd coatings in the nm range on printed circuit boards
Measuring very thin gold and palladium coatings on printed circuit boards with X-ray fluorescence, and how different detectors compare for trueness and repeatability.
Electronics and printed circuit boards
Measuring coatings and composition on circuit boards, connectors and semiconductors.
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Repeatability and trueness of Au / Pd measurements on leadframes
Comparing X-ray fluorescence instruments with two other methods on gold coatings of only a few nanometres on leadframes.
Thickness measurement of conformal coatings on printed circuit boards
Checking the thickness of conformal coatings that protect electronics against moisture, dust, chemicals and temperature extremes.
Thickness and composition of NiP on connectors and small structures on PCBs
Measuring both thickness and phosphorus content of NiP layers on connectors and tiny PCB structures with the XDV-µ.
Material analysis of solder bumps in IC packaging
Checking the composition of lead-free solder bumps (e.g. SnAgCu) in semiconductor packaging to ensure solderability.
Material analysis of solder bumps in IC packaging
Checking the composition of lead-free solder bumps (e.g. SnAgCu) in semiconductor packaging to ensure solderability.
Measuring the copper thickness in plated through-holes on PCBs
Non-destructive measurement of copper in holes of 0.8–1.2 mm diameter on multilayer PCBs with a dedicated probe.
Measuring the copper thickness in plated through-holes on PCBs
Non-destructive measurement of copper in holes of 0.8–1.2 mm diameter on multilayer PCBs with a dedicated probe.
Determining the mechanical characteristics of gold coatings on PCB conductive traces
Measuring the hardness of very thin gold coatings on printed circuit board traces by indentation at tiny loads and travel distances.
Determining the mechanical characteristics of gold coatings on PCB conductive traces
Measuring the hardness of very thin gold coatings on printed circuit board traces by indentation at tiny loads and travel distances.
Controlling solder quality by measuring the remaining pure tin on PCBs
Coulometry measures the remaining pure tin in coatings on printed circuit boards, which decides lead-free solderability.
Controlling solder quality by measuring the remaining pure tin on PCBs
Coulometry measures the remaining pure tin in coatings on printed circuit boards, which decides lead-free solderability.
Controlling the thickness of solder resist in PCB manufacture
Measuring non-conductive solder resist over copper with a high-frequency probe of low eddy-current depth, to prevent solder bridging and short circuits.
Controlling the thickness of solder resist in PCB manufacture
Measuring non-conductive solder resist over copper with a high-frequency probe of low eddy-current depth, to prevent solder bridging and short circuits.
X-ray instruments for standard PCB applications
Fast, precise, non-destructive coating thickness measurement on standard printed circuit boards with the X-RAY PCB instrument line.
X-ray instruments for standard PCB applications
Fast, precise, non-destructive coating thickness measurement on standard printed circuit boards with the X-RAY PCB instrument line.
Ensuring high efficiency of thin-film photovoltaic modules with inline measurement
Monitoring thickness and composition in thin-film solar module production (CIS/CIGS, CdTe) with X-ray heads fitted to vacuum chambers.
Ensuring high efficiency of thin-film photovoltaic modules with inline measurement
Monitoring thickness and composition in thin-film solar module production (CIS/CIGS, CdTe) with X-ray heads fitted to vacuum chambers.
Determination of Pb in solder alloys for high-reliability applications
Analysing solder composition with the XDAL to confirm the Pb content where lead is still permitted because of tin whiskers.
Determination of Pb in solder alloys for high-reliability applications
Analysing solder composition with the XDAL to confirm the Pb content where lead is still permitted because of tin whiskers.
Simplifying quality control on PCBs with automatic pattern recognition
Automatic alignment of measuring points on large boards, removing the need to position manually on tiny contact pads (XRF).
Simplifying quality control on PCBs with automatic pattern recognition
Automatic alignment of measuring points on large boards, removing the need to position manually on tiny contact pads (XRF).
Measurement of the copper thickness on printed circuit boards
Mobile checking of copper thickness (start copper and end copper) during production, at goods-in and outgoing with the SR-SCOPE.
Fischer X-RAY instruments for printed circuit boards (PCB)
Overview of the XULM-PCB and XDLM-PCB measuring systems for coating thickness and composition analysis on boards up to 610 × 610 mm (PDF in Slovenian).
Analysis of CIGS solar cells with EDXRF
Non-destructive measurement of composition and layer thickness of Cu-In-Ga-Se and Mo on solar cells by energy-dispersive X-ray fluorescence; thickness repeatability below 0.5 %.
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