FISCHER FISCHERSCOPE X-RAY XDV-µ SEMI

FISCHER FISCHERSCOPE X-RAY XDV-µ SEMI

The XDV-µ SEMI is the optimal solution for fully automated inspection of microstructures on wafers. It is suitable for thickness measurement and element analysis of base metallizations in the nanometer range, C4 solder balls, lead-free solder caps on copper pillars, small contact areas and 2.5D/3D packaging. It complies with the relevant SEMI standards and is ideal for process monitoring in manufacturing.

Technical data

Application

Wafers up to 12 inches; smallest structures, very thin and multi-layer systems

X-ray tube

Microfocus tube Ultra with tungsten anode (molybdenum optional), 4-fold changeable filter

Measuring spot

Polycapillary optics, approx. 10 or 17 µm (half-width)

Detector

Silicon drift detector 20 mm² or 50 mm², Peltier cooling

Interfaces

Standardized SECS/GEM communication